Glass Wafer Manufacturing Capabilities & Target Specifications

Specification Item	Manufacturing Capabilities		Target Specifications
Product Size	12"	8"	12"	8"
Dimensions	Ø 300 ± 0.05 mm	Ø 200 ± 0.05 mm	Ø 300 ± 0.05 mm	Ø 200 ± 0.05 mm
Thickness	0.4 - 3.0 mm	0.4 - 3.0 mm	0.3 - 3.0 mm	0.3 - 3.0 mm
Thk. Tolerance	± 0.010 mm		± 0.005 mm
TTV	< 0.8 um	< 0.5 um	< 0.5 um	< 0.3 um
BOW	< 30 um	< 20 um	< 20 um	< 15 um
WARP	< 30 um	< 30 um	< 20 um	< 15 um
Notch Specification	Semi STD Notch		Semi STD Notch
Edge Chamfer	As per customer requirement / Protective Chamfer		As per customer requirement / Protective Chamfer
Marking	Laser Marking (Outsourced)		Laser Marking (In-house)
Surface Roughness	< 1 nm	< 1 nm	< 0.5 nm	< 0.5 nm
Surface Quality (S/D)	40/20		20/10

Carrier Process – Simplified Flow Diagram

Ingot Process – Simplified Flow Diagram