Process Equipment and Capabilities
| Process | Capability Specification |
|---|---|
| Cylindrical Rounding | Diameter Accuracy ±0.1 mm |
➤ Converts square glass ingots into round glass rods.
➤ Machined to customer-specified outer diameter dimensions.
| Process | Capability Specification |
|---|---|
| Wire Saw Slicing | TTV<10um BOW/WARP<40um |
➤ Cuts round glass rods into wafers according to required thickness specifications.
➤ Selects appropriate roller pitch based on product thickness.
➤ Maximum cutting size: 12 inch diameter.
| Process | Capability Specification |
|---|---|
| Edge Chamfering / Notch Formation | Diameter Accuracy ±0.01 mm |
➤ Performs edge grinding, chamfering, and notch processing according to customer specifications.
➤ Achieves final outer diameter dimensions.
➤ Fully customizable for various product sizes and shapes.
| Process | Size | Capability Specification |
|---|---|---|
| Double-Sided Lapping | 8" | TTV<2um BOW/WARP<30um |
| Double-Sided Polishing | TTV<0.5um BOW/WARP<30um Ra<1nm | |
| Double-Sided Lapping | 12" | TTV<3um BOW/WARP<30um |
| Double-Sided Polishing | TTV<0.8um BOW/WARP<30um Ra<1nm |
➤ Processes semi-finished wafers to specified thickness and surface quality requirements.
➤ Minimum achievable thickness: 400 μm.
| Process | Capability Specification |
|---|---|
| Ultrasonic Cleaning | Maximum size 12 inch |
| IR Drying |
➤ Utilizes a multi-tank wet bench system with automated ultrasonic cleaning using both chemical and pure water processes.
➤ Applies different ultrasonic frequencies to effectively remove particles of varying sizes.
➤ Employs a cantilever transfer platform to minimize contamination and scratches from contact.
➤ The cleanroom is the highest grade Class 10
| Process | Capability Specification |
|---|---|
| Package | Vacuum Packaging (up to 12 inch) |
➤ We offer customizable product specifications and a variety of packaging solutions to meet specific customer requirements.
Inspection Equipment and Capabilities by Process Station
| No. | Attributes | Metrology Equipment | Remark |
|---|---|---|---|
| 1 | Diameter, length, angle, etc. | Vernier caliper / 2.5D | Resolution: 0.01 mm / 0.001 um |
| 2 | Thickness, TTV, Bow, Warp etc. | Sentronics SemDex M1 | Resolution: 0.001 um |
| 3 | Roughness (Edge / Surface) | Edge: KEYENCE Sentronics SemDex301 White light interferometer |
Resolution: 0.01 nm |
| 4 | Wafer defect inspection | AOI / Visual Inspection | |
| 5 | Light strength | Illuminance Meter | Lux: 50K ~ 400K |